HCS8806 – Micro Bonder

HCS8806 – Micro Bonder

The HCS8806 series “Micro Bonder” is a compact portable composite curing controller designed to accomplish localized repairs on composite structures or for use in other composite curing / training applications. This model has 6 thermocouple inputs.



  • Operating Voltage: 120 or 240V, single phase
  • Current (Amps) Maximum Load: 16 Amps
  • Operating Environmental Limitations:
  • Temperature: 0 – 115° F (-18° – 46.1° C)
  • Relative Humidity: 0 – 99%
  • Cure Temperature Range: 0 – 500° F (-18° – 260° C)
  • Control Parameters:
  • Internal Control System Resolution: 0.5° F (0.28° C)
  • Display Resolution: 1.0° F (0.55° C)
  • Program Resolution: 1.0° F (0.55° C)
  • Temperature Accuracy: +/- 1° F (0.55° C)
  • Control Methods:
  • Hottest TC
  • TC Average
  • Coolest TC
  • Vacuum Monitoring Capability: 0 – 30 in/Hg
  • Temperature Feedback: 6 Type J Thermocouples
  • Operation Interface: 4 Push Buttons with Menu Selected/Real Language Screens on a Dark and Sunlight Readable 2.8 in. (71.1mm) Liquid Crystal Display (LCD)
  • Power Failure/Recovery: Power Recovery within 2 minutes of power loss results in continued program operation
  • Alarm Volume: 77 dB (Adjustable)
  • Programs Stored to Memory: 8 Separate programs – either downloaded via USB, or operator-entered
  • Cure Data Download: USB Uploadable to HEATCON® Composite Systems DCAS Software
  • Dimensions and Weight Control Unit:
  • 10 in. x 6.5 in. x 2.5 in. (254mm x 165.1mm x 63.5mm)
  • 4.1 lbs (1.9kg)

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