HCS2405-040 – Foaming Core Splice Adhesive EF562

HCS2405-040 – Foaming Core Splice Adhesive EF562

The Foaming Core Splice Adhesive EF562 is a general purpose curing foaming adhesive that is designed for temperatures from -67 to 350°F (-55°C to 177°C). This adhesive has low exothermic properties, which makes it ideal for thick splices or co-cure conditions.

Manufacturer Specifications:
  • BMS5-90
  • IPS 10-02-001-05
Packaging and Shipping:
  • This product requires HEATCON’s Dry Ice Packaging Services
  • Overnight (next day) or 2-day shipping available
Size Available:
  • Full Sheet (1ft x 2ft)



The Foaming Core Splice Adhesive EF562 is a general purpose curing foaming adhesive that is designed for temperatures from -67 to 350°F (-55°C to 177°C).

Features Include:

  • Limits moisture ingression into splice area
  • Asbestos Free
  • Dual cure capabilities at 250°F or 350°F (121°C or 177°C).
  • Excellent slump resistance
  • Ideal for thick splices or co-cure conditions

Specifications Available:

Spec OEM Name Type Class Grade Rev
BMS5-90 Boeing III 50 W
IPS10-02-001-05 Airbus B

Specifications Overview:

  • Manufacturer #: Henkel Loctite EF 562 AERO
  • Nominal Cured Thickness: 0.05 in
  • Cure Temp: 250-350°F (121-177°C)
  • Storage: 0°F (-18°C)
  • MSDS & Manufacturer’s Certification provided

We offer the Foaming Core Splice Adhesive EF562 material in the following:

  • Full Sheet (1ft x 2ft) – HCS2405-040

Dry Ice Packaging Services: For composite materials that require to be in freezing temperatures while in transit, Heatcon Composites Systems offers Dry Ice Packaging Services. Our Dry Ice Packaging Services include:

  • Standard corrugated, 100% recyclable cardboard boxes (sizes vary)
  • Foam-lined box for insulation
  • Dry ice packets
    • US Domestic Shipments – 30lbs (14kg)
    • International Shipments – 80lbs (36kg)
  • 2- Temperature recorders (two are added in case one fails)
  • Suspended cores for prepreg and film adhesives rolls
  • Necessary documentation for certified material

Events

*  Your Email Address: